BYCHIPS is the stocking distributor for CPX3225A752D, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for CPX3225A752D by email, we will give you a best price according your plan.
Buy CPX3225A752D with BYCHPS
Buy with guarantee
CPX3225A752D
- Part Number:
- CPX3225A752D
- Manufacturer:
- Seiko Instruments, Inc.
- Description:
- CAPACITOR 7500UF 2.6V 1210
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16438 Pieces
- Data sheet:
- 1.CPX3225A752D.pdf2.CPX3225A752D.pdf
Introduction
Specifications
| Voltage - Rated: | 2.6V |
|---|---|
| Tolerance: | - |
| Termination: | - |
| Size / Dimension: | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
| Series: | CPX |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 1210 (3225 Metric) |
| Other Names: | 728-1083-2 |
| Operating Temperature: | -30°C ~ 70°C |
| Mounting Type: | Surface Mount |
| Manufacturer Standard Lead Time: | 13 Weeks |
| Manufacturer Part Number: | CPX3225A752D |
| Lifetime @ Temp.: | - |
| Lead Spacing: | - |
| Height - Seated (Max): | 0.035" (0.90mm) |
| Expanded Description: | 7.5mF (EDLC) Supercapacitor 2.6V 1210 (3225 Metric) 25 Ohm @ 1kHz |
| ESR (Equivalent Series Resistance): | 25 Ohm @ 1kHz |
| Description: | CAPACITOR 7500UF 2.6V 1210 |
| Capacitance: | 7.5mF |
| Email: | [email protected] |
Related parts for CPX3225A752D
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
EEC-EP0F333A | Panasonic Electronic Components | CAP 33MF -20% +80% 3.3V SMD | Inquiry |
 |
PM-5R0V474-R | Eaton | CAP 470MF -20% +80% 5V T/H | Inquiry |
 |
FYD0H473ZF | KEMET | CAP 47MF -20% +80% 5.5V T/H | Inquiry |
 |
JJD0E607MSECBN | Nichicon | CAP 600F 20% 2.5V CHASSIS MOUNT | Inquiry |
 |
FS0H105ZF | KEMET | CAP 1F -20% +80% 5.5V T/H | Inquiry |
 |
PHV-5R4V155-R | Eaton | CAP 1.5F -10% +30% 5.4V T/H | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers