BYCHIPS is the stocking distributor for B82500C0000A005, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for B82500C0000A005 by email, we will give you a best price according your plan.
Buy B82500C0000A005 with BYCHPS
Buy with guarantee
B82500C0000A005
- Part Number:
- B82500C0000A005
- Manufacturer:
- EPCOS
- Description:
- FIXED INDUCT 820UH 500MA 2.5 OHM
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13098 Pieces
- Data sheet:
- B82500C0000A005.pdf
Introduction
Specifications
| Type: | Wirewound |
|---|---|
| Tolerance: | ±20% |
| Size / Dimension: | 0.394" Dia x 1.276" L (10.00mm x 32.40mm) |
| Shielding: | Unshielded |
| Series: | B82500 |
| Ratings: | - |
| Q @ Freq: | - |
| Packaging: | Bulk |
| Package / Case: | Axial |
| Other Names: | 495-75966 B82500C A 5 B82500C0000A005-ND B82500CA5 |
| Operating Temperature: | -55°C ~ 125°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | Ferrite |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | B82500C0000A005 |
| Inductance: | 820µH |
| Height - Seated (Max): | - |
| Frequency - Test: | 100kHz |
| Frequency - Self Resonant: | 3MHz |
| Expanded Description: | 820µH Unshielded Wirewound Inductor 500mA 2.5 Ohm Axial |
| Description: | FIXED INDUCT 820UH 500MA 2.5 OHM |
| DC Resistance (DCR): | 2.5 Ohm |
| Current Rating: | 500mA |
| Current - Saturation: | - |
| Email: | [email protected] |
Related parts for B82500C0000A005
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
B82500C0000A010 | EPCOS (TDK) | FIXED INDUCT 120UH 2A 150 MOHM | Inquiry |
 |
B82500C0000A002 | EPCOS (TDK) | FIXED INDUCT 3.9MH 200MA 20 OHM | Inquiry |
|
B82500C0000A008 | EPCOS (TDK) | FIXED INDUCT 330UH 1A 600 MOHM | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers