BYCHIPS is the stocking distributor for 4608X-102-682LF, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 4608X-102-682LF by email, we will give you a best price according your plan.
Buy 4608X-102-682LF with BYCHPS
Buy with guarantee
4608X-102-682LF
- Part Number:
- 4608X-102-682LF
- Manufacturer:
- Bourns, Inc.
- Description:
- RES ARRAY 4 RES 6.8K OHM 8SIP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13278 Pieces
- Data sheet:
- 4608X-102-682LF.pdf
Introduction
Specifications
| Tolerance: | ±2% |
|---|---|
| Temperature Coefficient: | ±100ppm/°C |
| Supplier Device Package: | 8-SIP |
| Size / Dimension: | 0.798" L x 0.098" W (20.27mm x 2.49mm) |
| Series: | 4600X |
| Resistance (Ohms): | 6.8k |
| Power Per Element: | 300mW |
| Packaging: | Bulk |
| Package / Case: | 8-SIP |
| Other Names: | 4608X-102-682LF-ND 4608X-2-682LF 4608X102682LF |
| Operating Temperature: | -55°C ~ 125°C |
| Number of Resistors: | 4 |
| Number of Pins: | 8 |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 13 Weeks |
| Manufacturer Part Number: | 4608X-102-682LF |
| Height - Seated (Max): | 0.200" (5.08mm) |
| Expanded Description: | 6.8k Ohm ±2% 300mW Power Per Element Isolated Resistor Network/Array ±100ppm/°C 8-SIP |
| Description: | RES ARRAY 4 RES 6.8K OHM 8SIP |
| Circuit Type: | Isolated |
| Applications: | - |
| Email: | [email protected] |
Related parts for 4608X-102-682LF
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
4608X-101-151LF | Bourns Inc. | RES ARRAY 7 RES 150 OHM 8SIP | Inquiry |
|
4608X-102-122 | Bourns Inc. | RES ARRAY 4 RES 1.2K OHM 8SIP | Inquiry |
|
4608X-102-123LF | Bourns Inc. | RES ARRAY 4 RES 12K OHM 8SIP | Inquiry |
|
4608X-104-331/471 | Bourns Inc. | RES NETWORK 12 RES MULT OHM 8SIP | Inquiry |
|
4608X-101-471 | Bourns Inc. | RES ARRAY 7 RES 470 OHM 8SIP | Inquiry |
|
4608X-102-220LF | Bourns Inc. | RES ARRAY 4 RES 22 OHM 8SIP | Inquiry |
|
4608X-AP2-330LF | Bourns Inc. | RES ARRAY 4 RES 33 OHM 8SIP | Inquiry |
|
4608X-102-180LF | Bourns Inc. | RES ARRAY 4 RES 18 OHM 8SIP | Inquiry |
|
4608X-102-121 | Bourns Inc. | RES ARRAY 4 RES 120 OHM 8SIP | Inquiry |
|
4608X-101-823 | Bourns Inc. | RES ARRAY 7 RES 82K OHM 8SIP | Inquiry |
|
4608X-102-103LF | Bourns Inc. | RES ARRAY 4 RES 10K OHM 8SIP | Inquiry |
|
4608X-102-152LF | Bourns Inc. | RES ARRAY 4 RES 1.5K OHM 8SIP | Inquiry |
|
4608X-102-684 | Bourns Inc. | RES ARRAY 4 RES 680K OHM 8SIP | Inquiry |
|
4608X-104-471/681L | Bourns Inc. | RES NETWORK 12 RES MULT OHM 8SIP | Inquiry |
|
4608X-102-273LF | Bourns Inc. | RES ARRAY 4 RES 27K OHM 8SIP | Inquiry |
|
4608X-101-182 | Bourns Inc. | RES ARRAY 7 RES 1.8K OHM 8SIP | Inquiry |
|
4608X-101-203LF | Bourns Inc. | RES ARRAY 7 RES 20K OHM 8SIP | Inquiry |
|
4608X-102-223LF | Bourns Inc. | RES ARRAY 4 RES 22K OHM 8SIP | Inquiry |
|
4608X-AP2-102LF | Bourns Inc. | RES ARRAY 4 RES 1K OHM 8SIP | Inquiry |
|
4608X-101-124 | Bourns Inc. | RES ARRAY 7 RES 120K OHM 8SIP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers