BYCHIPS is the stocking distributor for 450TXW33MEFC10X40, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 450TXW33MEFC10X40 by email, we will give you a best price according your plan.
Buy 450TXW33MEFC10X40 with BYCHPS
Buy with guarantee
450TXW33MEFC10X40
- Part Number:
- 450TXW33MEFC10X40
- Manufacturer:
- Rubycon
- Description:
- CAP ALUM
- Available Quantity:
- 16629 Pieces
Introduction
Specifications
| Series: | * |
|---|---|
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | 450TXW33MEFC10X40 |
| Expanded Description: | Aluminum Capacitors |
| Description: | CAP ALUM |
| Email: | [email protected] |
Related parts for 450TXW33MEFC10X40
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
450TXW39MEFC12.5X35 | Rubycon | CAP ALUM 39UF 20% 450V RADIAL | Inquiry |
|
450TXW39MEFC10X50 | Rubycon | CAP ALUM | Inquiry |
 |
450TXW100MEFC18X35 | Rubycon | CAP ALUM 100UF 20% 450V RADIAL | Inquiry |
 |
450TXW82MEFC18X30 | Rubycon | CAP ALUM 82UF 20% 450V RADIAL | Inquiry |
|
450TXW68MEFC18X25 | Rubycon | CAP ALUM 68UF 20% 450V RADIAL | Inquiry |
|
450TXW120MEFC18X40 | Rubycon | CAP ALUM 120UF 20% 450V RADIAL | Inquiry |
 |
450TXW47MEFC12.5X40 | Rubycon | CAP ALUM 47UF 20% 450V RADIAL | Inquiry |
|
450TXW68MEFC16X35 | Rubycon | CAP ALUM 68UF 20% 450V RADIAL | Inquiry |
|
450TXW68MEFC16X30 | Rubycon | CAP ALUM | Inquiry |
 |
450TXW47MKC12.5X40 | Rubycon | CAP ALUM 47UF 20% 450V RADIAL | Inquiry |
 |
450TXW33MEFC12.5X30 | Rubycon | CAP ALUM 33UF 20% 450V RADIAL | Inquiry |
|
450TXW56MEFR16X30 | Rubycon | CAP ALUM | Inquiry |
 |
450TXW47MEFC16X25 | Rubycon | CAP ALUM 47UF 20% 450V RADIAL | Inquiry |
|
450TXW68MEFC12.5X50 | Rubycon | CAP ALUM | Inquiry |
|
450TXW82MEFC16X40 | Rubycon | CAP ALUM 82UF 20% 450V RADIAL | Inquiry |
|
450TXW82MEFR16X40 | Rubycon | CAP ALUM | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers