BYCHIPS is the stocking distributor for 3KASMC14AHE3_A/H, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 3KASMC14AHE3_A/H by email, we will give you a best price according your plan.
Buy 3KASMC14AHE3_A/H with BYCHPS
Buy with guarantee
3KASMC14AHE3_A/H
- Part Number:
- 3KASMC14AHE3_A/H
- Manufacturer:
- Vishay / Semiconductor - Diodes Division
- Description:
- TVS DIODE 14VWM 23.2VC DO214AB
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16735 Pieces
- Data sheet:
- 3KASMC14AHE3_A/H.pdf
Introduction
Specifications
| Voltage - Reverse Standoff (Typ): | 14V |
|---|---|
| Voltage - Clamping (Max) @ Ipp: | 23.2V |
| Voltage - Breakdown (Min): | 15.6V |
| Unidirectional Channels: | 1 |
| Type: | Zener |
| Supplier Device Package: | DO-214AB (SMCJ) |
| Series: | Automotive, AEC-Q101, PAR® |
| Power Line Protection: | No |
| Power - Peak Pulse: | 3000W (3kW) |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | DO-214AB, SMC |
| Operating Temperature: | -65°C ~ 185°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | 3KASMC14AHE3_A/H |
| Description: | TVS DIODE 14VWM 23.2VC DO214AB |
| Current - Peak Pulse (10/1000µs): | 129A |
| Capacitance @ Frequency: | - |
| Applications: | Automotive |
| Email: | [email protected] |
Related parts for 3KASMC14AHE3_A/H
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers