BYCHIPS is the stocking distributor for 35MXC22000MEFCSN35X50, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 35MXC22000MEFCSN35X50 by email, we will give you a best price according your plan.
Buy 35MXC22000MEFCSN35X50 with BYCHPS
Buy with guarantee
35MXC22000MEFCSN35X50
- Part Number:
- 35MXC22000MEFCSN35X50
- Manufacturer:
- Rubycon
- Description:
- CAP ALUM 22000UF 20% 35V SNAP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18437 Pieces
Introduction
Specifications
| Voltage Rating: | 35V |
|---|---|
| Tolerance: | ±20% |
| Surface Mount Land Size: | - |
| Size / Dimension: | 1.378" Dia (35.00mm) |
| Series: | MXC |
| Ripple Current: | - |
| Polarization: | Polar |
| Packaging: | Bulk |
| Package / Case: | Radial, Can - Snap-In |
| Other Names: | 1189-2791 |
| Operating Temperature: | -40°C ~ 105°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | 35MXC22000MEFCSN35X50 |
| Lifetime @ Temp.: | 3000 Hrs @ 105°C |
| Lead Spacing: | 0.394" (10.00mm) |
| Impedance: | - |
| Height - Seated (Max): | 2.047" (52.00mm) |
| Expanded Description: | 22000µF 35V Aluminum Capacitors Radial, Can - Snap-In 3000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | - |
| Description: | CAP ALUM 22000UF 20% 35V SNAP |
| Capacitance: | 22000µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for 35MXC22000MEFCSN35X50
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
35MXC22000MEFCSN35X40 | Rubycon | CAP ALUM 22000UF 20% 35V SNAP | Inquiry |
|
35MXC22000MEFCSN30X50 | Rubycon | CAP ALUM 22000UF 20% 35V SNAP | Inquiry |
 |
35MXC22000MEFC35X40 | Rubycon | CAP ALUM 22000UF 20% 35V SNAP | Inquiry |
|
35MXC22000MEFC30X50 | Rubycon | CAP ALUM 22000UF 20% 35V SNAP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers