BYCHIPS is the stocking distributor for 2833932, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 2833932 by email, we will give you a best price according your plan.
Buy 2833932 with BYCHPS
Buy with guarantee
2833932
- Part Number:
- 2833932
- Manufacturer:
- Phoenix Contact
- Description:
- PLUG-IN MODULE FOR MOUNTING
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17335 Pieces
- Data sheet:
- 2833932.pdf
Introduction
Specifications
| Specifications: | Varistor, 48 ~ 60VAC/DC |
|---|---|
| Series: | - |
| Other Names: | V3- 48- 60UC |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 9 Weeks |
| Manufacturer Part Number: | 2833932 |
| For Use With/Related Products: | PR3 Series |
| Expanded Description: | Module, LED and/or Protection PR3 Series |
| Description: | PLUG-IN MODULE FOR MOUNTING |
| Color: | - |
| Accessory Type: | Module, LED and/or Protection |
| Email: | [email protected] |
Related parts for 2833932
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
2833929 | Phoenix Contact | PLUG-IN MODULE FOR MOUNTING | Inquiry |
 |
1393760-2 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET HOLD DOWN SPRING | Inquiry |
 |
HS13 | Crydom Co. | HEATSINK SSR 0.8DEG C/W 3PH DIN | Inquiry |
|
2833958 | Phoenix Contact | RELAY GEN PURPOSE DPDT 10A 60V | Inquiry |
 |
J7TKN-C-42 | Omron Automation and Safety | RELAY THERMAL OVERLOAD 28-42A | Inquiry |
|
2833945 | Phoenix Contact | PLUG-IN MODULE FOR MOUNTING | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers