BYCHIPS is the stocking distributor for XCZU4CG-2FBVB900I, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for XCZU4CG-2FBVB900I by email, we will give you a best price according your plan.
Buy XCZU4CG-2FBVB900I with BYCHPS
Buy with guarantee
XCZU4CG-2FBVB900I
- Part Number:
- XCZU4CG-2FBVB900I
- Manufacturer:
- Xilinx
- Description:
- IC FPGA 204 I/O 900FCBGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16645 Pieces
- Data sheet:
- XCZU4CG-2FBVB900I.pdf
Introduction
Specifications
| Supplier Device Package: | 900-FCBGA (31x31) |
|---|---|
| Speed: | 533MHz, 1.3GHz |
| Series: | Zynq® UltraScale+™ MPSoC CG |
| Primary Attributes: | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| Peripherals: | DMA, WDT |
| Packaging: | Tray |
| Package / Case: | 900-BBGA, FCBGA |
| Operating Temperature: | -40°C ~ 100°C (TJ) |
| Number of I/O: | 204 |
| Moisture Sensitivity Level (MSL): | 4 (72 Hours) |
| Manufacturer Part Number: | XCZU4CG-2FBVB900I |
| MCU RAM: | 256KB |
| MCU Flash: | - |
| Expanded Description: | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 256KB 533MHz, 1.3GHz 900-FCBGA (31x31) |
| Description: | IC FPGA 204 I/O 900FCBGA |
| Core Processor: | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Connectivity: | CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture: | MCU, FPGA |
| Email: | [email protected] |
Related parts for XCZU4CG-2FBVB900I
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers