BYCHIPS is the stocking distributor for STM32F207IFH6, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for STM32F207IFH6 by email, we will give you a best price according your plan.
Buy STM32F207IFH6 with BYCHPS
Buy with guarantee
STM32F207IFH6
- Part Number:
- STM32F207IFH6
- Manufacturer:
- ST
- Description:
- IC MCU 32BIT 768KB FLASH 176UBGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19024 Pieces
- Data sheet:
- 1.STM32F207IFH6.pdf2.STM32F207IFH6.pdf
Introduction
Specifications
| Voltage - Supply (Vcc/Vdd): | 1.8 V ~ 3.6 V |
|---|---|
| Supplier Device Package: | 176-UFBGA (10x10) |
| Speed: | 120MHz |
| Series: | STM32 F2 |
| RAM Size: | 132K x 8 |
| Program Memory Type: | FLASH |
| Program Memory Size: | 768KB (768K x 8) |
| Peripherals: | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT |
| Packaging: | Tray |
| Package / Case: | 201-UFBGA |
| Oscillator Type: | Internal |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Number of I/O: | 140 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | STM32F207IFH6 |
| Expanded Description: | ARM® Cortex®-M3 STM32 F2 Microcontroller IC 32-Bit 120MHz 768KB (768K x 8) FLASH 176-UFBGA (10x10) |
| EEPROM Size: | - |
| Description: | IC MCU 32BIT 768KB FLASH 176UBGA |
| Data Converters: | A/D 24x12b, D/A 2x12b |
| Core Size: | 32-Bit |
| Core Processor: | ARM® Cortex®-M3 |
| Connectivity: | CAN, Ethernet, I²C, IrDA, LIN, Memory Card, SPI, UART/USART, USB OTG |
| Email: | [email protected] |
Related parts for STM32F207IFH6
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers