BYCHIPS is the stocking distributor for 10AX032E1F29E1HG, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 10AX032E1F29E1HG by email, we will give you a best price according your plan.
Buy 10AX032E1F29E1HG with BYCHPS
Buy with guarantee
10AX032E1F29E1HG
- Part Number:
- 10AX032E1F29E1HG
- Manufacturer:
- Altera (Intel)
- Description:
- IC FPGA 360 I/O 780FBGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13465 Pieces
- Data sheet:
- 1.10AX032E1F29E1HG.pdf2.10AX032E1F29E1HG.pdf
Introduction
Specifications
| Voltage - Supply: | 0.87 V ~ 0.98 V |
|---|---|
| Total RAM Bits: | 21040128 |
| Supplier Device Package: | 780-FBGA (29x29) |
| Series: | Arria 10 GX |
| Package / Case: | 780-BBGA, FCBGA |
| Operating Temperature: | 0°C ~ 100°C (TJ) |
| Number of Logic Elements/Cells: | 320000 |
| Number of LABs/CLBs: | 119900 |
| Number of I/O: | 360 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 13 Weeks |
| Manufacturer Part Number: | 10AX032E1F29E1HG |
| Description: | IC FPGA 360 I/O 780FBGA |
| Email: | [email protected] |
Related parts for 10AX032E1F29E1HG
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
10AX032E1F27I1HG | Altera | IC FPGA 240 I/O 672FBGA | Inquiry |
|
10AX032E1F29E1SG | Altera | IC FPGA 360 I/O 780FBGA | Inquiry |
|
10AX032E1F29I1SG | Altera | IC FPGA 360 I/O 780FBGA | Inquiry |
|
10AX032E1F29I1HG | Altera | IC FPGA 360 I/O 780FBGA | Inquiry |
|
10AX032E1F27E1SG | Altera | IC FPGA 240 I/O 672FBGA | Inquiry |
|
10AX032E1F27E1HG | Altera | IC FPGA 240 I/O 672FBGA | Inquiry |
|
10AX032E1F27I1SG | Altera | IC FPGA 240 I/O 672FBGA | Inquiry |
|
10AX032H2F34I1SG | Altera | IC FPGA 384 I/O 1152FCBGA | Inquiry |
|
10AX032E2F27I1HG | Altera | IC FPGA 240 I/O 672FBGA | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers